Product Details:
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Punching Speed: | 70-100 Strokes/min (SPM: 70-100) | Apply Encapsulation: | SOT SOD/TSOT/SOP/TO252 / TO263 / SMD Series |
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Punching Power: | Servo Motor Power -3~5T | Control System: | PLC (Omron) |
Detection System: | Feed And Discharge Dual Mirror CCD Image Detection | ||
High Light: | Auto Cam IC Packaging Equipment,Auto Plastic Sealing IC Packaging Equipment,100 strokes/min Transfer Molding Equipment |
IC Packaging | Auto Plastic Sealing Equipments | Auto Cam Cutting And Forming System
[Main feature]
• Function: After plastic sealing, the product is cut and bent to form;
• Punching speed: 70-100 strokes/min (SPM: 70-100)
• Apply encapsulation: SOT SOD/TSOT/SOP/TO252 / TO263 / SMD series;
• Punching power: servo motor power -3~5T;
• Control System: PLC (Omron)
• Operating system: touch screen + operation button, display UPH/SPM punch count function;
• Detection system: feed and discharge dual mirror CCD image detection;
• Feeding mechanism: rotating double magazine feeding;
• Receiving mechanism: Receiving material automatically into the box (bulk)
• Safety protection system: the equipment is equipped with leakage protection device, emergency stop button device and SENSOR protection device for all main guard doors. After the guard door is opened, the system should make a certain response to protect personal safety;
• Optional 1: CCD visual inspection device;
• Option 2: MES system networking function.
Semiconductor back-channel package device
[Advantage]
1. The use of imported raw materials, the use of imported advanced equipment manufacturing and testing, high precision equipment, stable performance;
2. Customized, strong wear resistance, high service life, quality assurance, no worries after sale.
#Samples#
Contact Person: Miss. Merry
Tel: +8618666474704
Fax: 86-769-81153616