Auto Semiconductor Packaging Equipment Packaging Testing Chips IC 98-1764kN

Semiconductor Packaging Equipment | Auto Packaging Testing Chips/ Semiconductor Devices/ IC

【 Feature 】

● Semiconductor packaging equipment is also known as chip packaging equipment and ic packaging equipment;

● Automatic packaging and testing of chips, semiconductor devices, ic and other products;

● Full servo control system, PLC(Omron) + host computer;

●WIN10+15 inch touch screen + touch keyboard;

●CCD image detection, feed anti-reaction detection;

● Standardized mold structure, easy to replace;

● High efficiency cake feeding components, aluminum box feeding;

● Support flexible expansion of up to 4 groups of presses to achieve high UPH;

● Equipped with visual system to identify feed direction;

● Automatic box entry, double box stacking type receiving;

● Optional mold vacuum function, mold isolation function, plastic sealing test function, etc.

● Customized, advanced technology, the use of imported raw materials, high precision equipment, stable performance, to ensure quality.

【 Performance parameters 】

● Clamping pressure: 98-1764kN;

● Injection pressure: 4.9-29.4kN adjustable;

● Suitable for lead frame/substrate size: wide 20-90mm, long 124-300mm;

● Suitable for plastic sealing material size: diameter φ11 ~20mm, length 12~35mm;