Semiconductor Solution IC Cutting Forming Machine | Auto Intelligent Cutting System

Semiconductor Solution | IC Cutting And Forming Machine | Auto Intelligent Cutting System

[Main Feature]

• Equipment function: After plastic sealing, the product is cut and bent to form;

• Punching speed :50~100 strokes/min (SPM:50~100);

• Apply encapsulation: SOP/SSOP/TSSOP/MSOP/TSOP/TO/DIP, etc;

• Punching power: servo motor power -3~5T;

• Control System: PLC (Omron);

• Operating system: Touch screen + operation button displays UPH/SPM punch count function;

• Detection system: feed and discharge dual mirror CCD image detection;

• Feeding mechanism: rotating double magazine feeding;

• Receiving mechanism: laminated coil automatic transfer receiving (tube loading);

• Safety protection system: the equipment is equipped with leakage protection device, emergency stop button device and all main guard doors are equipped with SENSOR protection device. After the guard door is opened, the system should make a certain response to protect personal safety.

Option 1: CCD visual inspection device;

Option 2: MES system networking function;

[Advantage]

1. The use of imported raw materials, the use of imported advanced equipment manufacturing and testing, high precision equipment, stable performance;
2. Customized, strong wear resistance, high service life, quality assurance, no worries after sale.

 #Samples Display#